Mask etch plasma reactor with cathode providing a uniform distribution of etch rate

ABSTRACT

A plasma reactor for etching a workpiece such as a rectangular or square mask, includes a vacuum chamber having a ceiling and a sidewall and a workpiece support pedestal within the chamber including a cathode having a surface for supporting a workpiece, the surface comprising plural respective zones, the respective zones of the surface being formed of respective materials of different electrical characteristics. The zones can be arranged concentrically relative to an axis of symmetry of the wafer support pedestal.

BACKGROUND

Fabrication of photolithographic masks for use in processing of ultralarge scale integrated (ULSI) semiconductor wafers requires a muchhigher degree of etch uniformity than semiconductor wafer processing. Asingle mask pattern generally occupies a four inch square area on aquartz mask. The image of the mask pattern is focused down to the areaof a single die (a one inch square) on the wafer and is then steppedacross the wafer, forming a single image for each die. Prior to etchingthe mask pattern into the quartz mask, the mask pattern is written inphotoresist by a scanning electron beam, a time consuming process whichmakes the cost of the mask very high. The mask etch process is notuniform across the surface of the mask. Moreover, the e-beam writtenphotoresist pattern is itself non-uniform, and exhibits, in the case of45 nm feature sizes on the wafer, as much as 2-3 nm variation incritical dimension (e.g., line width) across the entire mask. (Thisvariation is the 3σ variance of all measured line widths, for example.)Such non-uniformities in photoresist critical dimension typically variesamong different mask sources or customers. In order to meet currentrequirements, the mask etch process must not increase this variation bymore than 1 nm, so that the variation in the etched mask pattern cannotexceed 3-4 nm. These stringent requirements arise from the use ofdiffraction effects in the quartz mask pattern to achieve sharp imageson the wafer. It is difficult to meet such requirements with currenttechnology. It will be even more difficult for future technologies,which may involve 22 nm wafer feature sizes. This difficulty iscompounded by the phenomenon of etch bias, in which the depletion of thephotoresist pattern during mask etch causes a reduction in line width(critical dimension) in the etched pattern on the quartz mask. Thesedifficulties are inherent in the mask etch process because the etchselectivity of typical mask materials (e.g., quartz, chrome, molybdenumsilicide) relative to photoresist is typically less than one, so thatthe mask photoresist pattern is etched during the mask etch process.

Some mask patterns require etching periodic openings into the quartzmask by a precisely defined depth that is critical to achieving theextremely fine phase alignment of interfering light beams duringexposure of the wafer through the mask. For example, in one type ofphase shift mask, each line is defined by a chrome line with thin quartzlines exposed on each side of the chrome line, the quartz line on oneside being etched to a precise depth that provides a 180 degree phaseshift of the light relative to light passing through the un-etchedquartz line on the other side of the chrome line. In order to preciselycontrol the etch depth in the quartz, the etch process must be closelymonitored by periodically interrupting it to measure the etch depth inthe quartz. Each such inspection requires removing the mask from themask etch reactor chamber, removing the photoresist, measuring the etchdepth and then estimating the etch process time remaining to reach thetarget depth based upon the elapsed etch process time, depositing newphotoresist, e-beam writing the mask pattern on the resist,re-introducing the mask into the mask etch chamber and restarting theetch process. The estimate of remaining etch time to reach the desireddepth assumes that the etch rate remains stable and uniform, andtherefore is an unreliable estimate. The problems of such a cumbersomeprocedure include low productivity and high cost as well as increasedopportunity for introduction of contamination or faults in thephotoresist pattern. However, because of the requirement for anaccurately controlled etch depth, there has seemed to be no way aroundsuch problems.

The small tolerance in critical dimension variation requires extremelyuniform distribution of etch rate over the mask surface. In masksrequiring precise etch depth in the quartz material, there are twocritical dimensions, one being the line width and the other being theetch depth. Uniformity of both types of critical dimension requires auniform etch rate distribution across the mask. Non-uniformity in etchrate distribution can be reduced to some extent by employing a sourcepower applicator that can vary the radial distribution of the plasma iondensity, such as an inductive source power applicator consisting ofinner and outer coil antennas overlying the wafer. Such an approach,however, can only address non-uniformities that are symmetrical, namelya center-high or a center-low etch rate distribution. In practice,non-uniformities in etch rate distribution can be non-symmetrical, suchas a high etch rate in one corner of the mask, for example. A morefundamental limitation is that the mask etch process tends to have suchan extremely center-low distribution of etch rate that a tunablefeature, such an inductive power applicator having inner and outercoils, is incapable of transforming the etch rate distribution out ofthe center-low regime.

Another problem with non-uniform etch rate distribution is that the etchrate distribution tends to vary widely among different reactors of thesame design and can vary widely within the same reactor whenever a keypart or a consumable component is replaced, such as replacement of thecathode. The etch rate distribution appears to be highly sensitive tosmall variations in features of the replaced part, with unpredictablechanges upon consumable replacement.

SUMMARY OF THE INVENTION

A plasma reactor for etching a workpiece such as a rectangular or squaremask is provided. In one aspect, the reactor includes a vacuum chamberhaving a ceiling and a sidewall and a workpiece support pedestal withinthe chamber including a cathode having a surface for supporting aworkpiece. The surface comprises plural respective zones, each beingformed of respective materials of different electrical characteristics.The zones can be arranged concentrically relative to an axis of symmetryof the wafer support pedestal. In one embodiment, an inner zonecomprises a conductor material and an annular outer zone comprises aninsulator. In another embodiment, the zones are of different insulatormaterials of different electrical permittivities.

In another aspect, the cathode and an underlying facilities plate areformed of a metal. The cathode has a bottom surface and the facilitiesplate has a top surface facing the bottom surface of the cathode, andthey are fastened together by screws of a dissimilar metal. In order toreduce RF non-uniformities at the screw heads, a thin ring layer isprovided between the cathode and the facilities plate formed of thedissimilar metal and being located at the periphery of the cathode andfacilities plate. In order to improve uniformity of conductivity betweenthe cathode and the plate, a highly conductive coating is provided onthe periphery of facing surfaces of the cathode and plate.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above-recited features of the presentinvention can be understood in detail, a more particular description ofthe invention, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this invention and are therefore not to beconsidered limiting its scope, for the invention may admit to otherequally effective embodiments.

FIG. 1 depicts a plasma reactor for carrying out a mask etch process.

FIG. 2A depicts a lower portion of the reactor of FIG. 1.

FIG. 2B illustrates a mask support pedestal of the reactor of FIG. 1 ina raised position.

FIG. 3 is a top view of a cathode of the reactor of FIG. 1.

FIGS. 4 and 5 are top and side views of one alternative embodiment ofthe cathode.

FIGS. 6 and 7 are top and side views of another alternative embodimentof the cathode.

FIG. 8 is a simplified diagram of a plasma reactor having a backside endpoint detection apparatus.

FIGS. 9 and 10 are graphs of an optical end point detection signalobtained from the front side and back side, respectively, of the mask.

FIGS. 11 and 12 are graphs of an interference fringe optical signalobtained from the front side and back side, respectively, of the mask.

FIG. 13 is a graph of a multiple wavelength interference spectrum signalobtained in one embodiment of the reactor of FIG. 8.

FIG. 14 illustrates an embodiment of the reactor of FIG. 8 with backsideend point detection based upon overall reflected light intensity,corresponding to FIG. 10.

FIG. 15 illustrates an embodiment of the reactor of FIG. 8 with backsideendpoint detection based upon interference fringe counting,corresponding to FIG. 12.

FIG. 16 illustrates an embodiment of the reactor of FIG. 8 with backsideendpoint detection based upon multiple wavelength interferencespectrometry.

FIG. 17 illustrates an embodiment of the reactor of FIG. 8 with backsideendpoint detection based upon optical emission spectrometry (OES).

FIG. 18 illustrates a working example having both OES andinterference-based backside endpoint detection.

FIGS. 19 and 20 are perspective view of the cathode and facilitiesplate, respectively, of the embodiment of FIG. 18.

FIG. 21 is a cross-sectional view of the cathode of FIG. 19.

FIGS. 22A and 22B depict a sequence of steps in a quartz mask etchprocess employing backside endpoint detection.

FIGS. 23A, 23B, 23C, 23D and 23E depict a sequence of steps in achrome-molysilicide-quartz mask etch process employing backside endpointdetection.

FIGS. 24A, 24B, 24C, 24D and 24E depict a sequence of steps in achrome-quartz mask etch process employing backside endpoint detection.

FIGS. 25 and 26 are side and top views, respectively, of an embodimentin which real time etch rate distribution is continuously measured fromthe mask backside.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements and features of oneembodiment may be beneficially incorporated in other embodiments withoutfurther recitation. It is to be noted, however, that the appendeddrawings illustrate only exemplary embodiments of this invention and aretherefore not to be considered limiting of its scope, for the inventionmay admit to other equally effective embodiments.

DETAILED DESCRIPTION OF THE INVENTION Cathode with Enhanced RFUniformity:

We have discovered that one source of non-uniform etch rate distributionin mask etch processes is the existence of RF electricalnon-uniformities in the support pedestal or cathode holding the mask inthe plasma reactor in which the mask etch process is carried out. RFbias power is applied to the pedestal to control plasma ion energy atthe mask surface, while RF source power is applied to an overhead coilantenna, for example, to generate plasma ions. The RF bias powercontrols the electric field at the mask surface that affects the ionenergy. Since the ion energy at the mask surface affects the etch rate,RF electrical non-uniformities in the pedestal create non-uniformitiesin the distribution of etch rate across the mask surface. We havediscovered that there are several sources of RF non-uniformity in thepedestal. One is the titanium screws that fasten the aluminum pedestal(cathode) and aluminum facilities plate together. The screws createnodes in the electric field pattern across the surface of the pedestal(and therefore across the surface of the mask because their electricalproperties differ from that of the aluminum cathode. Another is thenon-uniform distribution of conductivity between the cathode and thefacilities plate. Electrical conduction between the facilities plate andthe cathode is confined primarily to the perimeter of the plate andcathode. This can be due at least in part to bowing of the cathodeduring plasma processing induced by vacuum pressure. The conductionaround this perimeter can be non-uniform due to a number of factors,such as uneven tightening of the titanium screws and/or surface finishvariations around the perimeter of either the plate or the pedestal. Wehave solved these problems by the introduction of several features thatenhance RF electrical uniformity across the pedestal. First, thenon-uniformities or discontinuities in the RF field arising from thepresence of the titanium screws in the aluminum cathode are addressed byproviding a continuous titanium ring extending around the perimeter ofthe top surface of the cathode that encompasses the heads of all thetitanium screws. Variations in conductivity due surface differences oruneven tightening of the titanium screws are addressed by providinghighly conductive nickel plating on the facing perimeter surfaces of thefacilities plate and the cathode, and by the introduction of an RFgasket between the facilities plate and the cathode that is compressedbetween them at their perimeter.

Referring to FIG. 1, a plasma reactor for etching patterns in a maskincludes a vacuum chamber 10 enclosed by a side wall 12 and an overlyingceiling 14 and is evacuated by a vacuum pump 15 that controls chamberpressure. A mask support pedestal 16 inside the chamber 10 supports amask 18. As will be described later in this specification, the masktypically consists of a quartz substrate and can further includeadditional mask thin film layers on the top surface of the quartzsubstrate, such as chrome and molybdenum silicide. In addition, apattern-defining layer is present, which may be photoresist or ahardmask formed of the chrome layer. In other types of masks, the quartzsubstrate has no overlying layers except for the photoresist pattern.

Plasma source power is applied by overlying inner and outer coilantennas 20, 22 driven by respective RF source power generators 24, 26through respective RF impedance match circuits 28, 30. While thesidewall 12 may be aluminum or other metal coupled to ground, theceiling 14 is typically an insulating material that permits inductivecoupling of RF power from the coil antennas 20, 22 into the chamber 10.Process gas is introduced through evenly spaced injection nozzles 32 inthe top of the side wall 12 through a gas manifold 34 from a gas panel36. The gas panel 36 may consist of different gas supplies 38 coupledthrough respective valves or mass flow controllers 40 to an output valveor mass flow controller 42 coupled to the manifold 34.

The mask support pedestal 16 consists of a metal (e.g., aluminum)cathode 44 supported on a metal (e.g., aluminum) facilities plate 46.The cathode 44 has internal coolant or heating fluid flow passages (notshown) that are fed and evacuated by supply and drain ports (not shown)in the facilities plate 46. RF bias power is applied to the facilitiesplate by an RF bias power generator 48 through an RF impedance matchcircuit 50. The RF bias power is conducted across the interface betweenthe facilities plate 46 and the cathode 44 to the top surface of thecathode 44. The cathode 44 has a central plateau 44 a upon which thesquare quartz mask or substrate 18 is supported. The plateau dimensionsgenerally match the dimensions of the mask 18, although the plateau 44 ais slightly smaller so that a small portion or lip 18 a of the maskperimeter extends a short distance beyond the plateau 44 a, as will bediscussed below. A pedestal ring 52 surrounding the plateau 44 a isdivided (in wedge or pie section fashion as shown in FIG. 2B or FIG. 7)into a cover ring 52 a forming about two-fifths of the ring 52 and acapture ring 52 b forming the remaining three-fifths of the ring 52. Thecapture ring 52 b has a shelf 54 in which the lip 18 a of the mask 18rests. Three lifts pins 56 (only one of which is visible in the view ofFIG. 1) lift the capture ring 52 b, which raises the mask 18 by the lip18 a whenever it is desired to remove the mask 18 from the supportpedestal 16. The pedestal ring 52 consists of layers 53, 55 of materialsof different electrical characteristics selected to match the RFimpedance presented by the combination of the quartz mask 18 and thealuminum plateau 44 a, at the frequency of the bias power generator 48.(Both the cover and capture rings 52 a, 52 b consist of the differentlayers 53, 55.) Moreover, the top surface of the capture ring 52 iscoplanar with the top surface of the mask 18, so that a large uniformsurface extending beyond the edge of the mask 18 promotes a uniformelectric field and sheath voltage across the surface of the mask 18during plasma processing. Typically, these conditions are met if thelower ring layer 55 is quartz and the upper ring layer 53 is a ceramicsuch as alumina. A process controller 60 controls the gas panel 36, theRF generators 24, 26, 48, and wafer handling apparatus 61. The waferhanding apparatus can include a lift servo 62 coupled to the lift pins56, a robot blade arm 63 and a slit valve 64 in the side wall 12 of thechamber 10.

A series of evenly spaced titanium screws 70 fasten the cathode 44 andfacilities plate 46 together along their perimeters. Because of theelectrical dissimilarities between the aluminum cathode/facilities plate44, 46 and the titanium screws 70, the screws 70 introduce discretenon-uniformities into the RF electrical field at the top surface of thecathode 44. Variations in the opposing surfaces of the cathode 44 andfacilities plate 46 create non-uniformities in the conductivity betweenthe cathode 44 and facilities plate 46 along their perimeter, whichintroduces corresponding non-uniformities in the RF electrical field.Because the cathode 44 tends to bow up at its center during plasmaprocessing (due to the chamber vacuum), the principal electrical contactbetween the cathode 44 and the facilities plate 46 is along theirperimeters. In order to reduce the sensitivity of the electricalconductivity between the cathode 44 and facilities plate 46 to (a)variations in tightness among the various titanium screws 70 and (b)variations in surface characteristics, an annular thin film 72 of ahighly conductive material such as nickel is deposited on the perimeterof the bottom surface 44 b of the cathode 44, while a matching annularthin film 74 of nickel (for example) is deposited on the perimeter ofthe top surface 46 a of the facilities plate 46. The nickel films 72, 72are in mutual alignment, so that the two annular nickel thin films 72,74 constitute the opposing contacting surfaces of the pedestal 44 andfacilities plate 46, providing a highly uniform distribution ofelectrical conductivity between them. Further improvement in uniformelectrical conductivity is realized by providing an annular groove 76along the perimeter of the bottom surface of the cathode 44 and placinga conductive RF gasket 80 within the groove 76. Optionally, a similarannular groove 78 in the top surface of the facilities plate 46 may beprovided that is aligned with the groove 76. The RF gasket 80 may be ofa suitable conventional variety, such as a thin metal helix that iscompressed as the cathode 44 and facilities plate 46 are pressedtogether and the screws 70 tightened. In order to reduce or eliminatethe point non-uniformities in electrical field distribution tending tooccur at the heads of the titanium screws 70, a continuous titanium ring82 is placed in an annular groove 84 in the perimeter of the top surfaceof the cathode 44.

FIG. 2A depicts the mask support pedestal 16 and its underlying liftassembly 90. The lift assembly 90 includes a lift spider 92 driven by apneumatic actuator or lift servo 94 and the three lift pins 56 restingon the lift spider 92. The lift pins 56 are guided in lift bellows 96that include ball bearings 98 for extremely smooth and nearlyfrictionless motion (to reduce contamination arising from wear). FIG. 2Bdepicts the cathode 44 with the capture ring 52 b and mask 18 in theraised position. The void formed by separation of the cover and capturerings 52 a, 52 b when the mask is raised permits access by a robot bladeto the mask 18.

The problem of an extremely center-low etch rate distribution across thesurface of the mask 18 is solved by altering the distribution of theelectrical properties (e.g., electrical permittivity) of the cathodeplateau 44 a. This is achieved in one embodiment by providing, on thetop surface of the plateau 44 a, a center insert 102 and a surroundingouter insert 104, the two inserts forming a continuous planar surfacewith the pedestal ring 52 and being of electrically different materials.For example, in order to reduce the tendency of the etch ratedistribution to be extremely center-low, the center insert 102 may be ofa conductive material (e.g., aluminum) while the outer insert 104 may beof an insulating material (e.g., a ceramic such as alumina). Thisconductive version of the center insert 102 provides a much lowerimpedance path for the RF current, boosting the ion energy and etch rateat the center of the mask 18, while the insulating outer insert 104presents a higher impedance, which reduces the etch rate at theperiphery of the mask 18. This combination improves the etch ratedistribution, rendering it more nearly uniform. With this feature, finetuning of the etch rate distribution can be performed by adjusting therelative RF power levels applied to the inner and outer coil antennas20, 22. The change in radial distribution of plasma ion density requiredto achieve uniform etch rate distribution is reduced to a much smalleramount which is within the capability of RF power apportionment betweenthe inner and outer coils 20, 22 to attain uniform etch ratedistribution. FIG. 3 is a top view of the inner and outer inserts 102,104. In an alternative embodiment, the inserts 102, 104 may beinsulators having different dielectric constants (electricalpermittivities). FIGS. 4 and 5 depict an elaboration upon this concept,in which four concentric rings 102, 104, 106, 108 of progressivelydifferent electrical properties are employed to render the etch ratedistribution more uniform. FIGS. 6 and 7 depict an alternativeembodiment that provides real-time tunability of distribution of RFelectrical properties of the cathode 44. A plunger 110 controls theaxial position of a movable aluminum plate 112 within a hollow cylinder114 in the center interior of the cathode 44. The aluminum plate 112 isin electrical contact with the remainder of the aluminum plateau 44 a.An insulator (e.g., ceramic) top film 116 can cover the top of thecathode 44. As the aluminum plate 112 is pushed closer to the top of thecylinder 114, the electrical impedance through the center region of thecathode 44 is reduced, thereby raising the etch rate at the center ofthe mask 18. Conversely, the etch rate at the mask center is reduced asthe aluminum plate 112 is moved downward in the cylinder 114 away fromthe mask 18. An actuator 118 controlling axial movement of the plunger110 can be governed by the process controller 60 (FIG. 1) to adjust theetch rate distribution to maximize uniformity or compensate fornon-uniformities.

Etch Rate Monitoring and End Point Detection Through the Mask Backside:

The high production cost of periodic interruptions of the etch processto measure the etch depth or critical dimension on the mask is reducedor eliminated using optical sensing through the cathode 44 and throughthe backside of the mask or substrate 18. It has been necessary tointerrupt the etch process to perform such periodic measurements becauseof the poor etch selectivity relative to photoresist: in general, themask materials etch more slowly than the photoresist. This problem istypically addressed by depositing a thick layer of photoresist on themask, but the high rate of etching of the resist renders the photoresistsurface randomly uneven or rough. This roughness affects light passingthrough the photoresist and so introduces noise into any opticalmeasurement of critical dimension or etch depth. Therefore, thephotoresist is temporarily removed for each periodic measurement toensure noise-free optical measurements, necessitating re-deposition ofphotoresist and re-writing of the reticle pattern into the photoresistbefore re-starting the interrupted mask etch process.

The mask etch plasma reactor depicted in FIG. 8 avoids thesedifficulties and permits continuous observation of critical dimensionsor measurement of etch depth during the entire etch process while themask or substrate 18 is left in place on the mask support pedestal 16using backside optical measurement apparatus provided within the cathode44. The backside measurement apparatus takes advantage of the opticallytransparent nature of the mask substrate 18, which is typically quartz.The thin films that may be deposited over it (such as chrome ormolybdenum silicide) may be opaque, but the formation of patternedopenings defining the reticle pattern of the mask 18 can be sensedoptically. The change in light intensity reflected by such layers ortransmitted through such layers may be observed at the mask back sidethrough the cathode 44. This observation may be used to perform etchprocess end point detection. When etching the quartz material, opticalinterference observed at the mask back side through the cathode 44 maybe sensed to perform etch depth measurements in real time during theetch process. One advantage is that the images or light signals sensedfrom the mask backside are not affected by photoresist noise, or atleast are affected very little compared with attempts to perform suchmeasurements from the top surface (photoresist side) of the mask 18.

For these purposes, the reactor of FIG. 8 includes a recess 120 withinthe top surface of the cathode 44 that accommodates a lens 122 whoseoptical axis faces the backside of the mask or substrate 18. A pair ofoptical fibers 124, 126, whose diameters are small relative to the lens122, have ends 124 a, 126 a close to or contacting the lens 122 and bothare aligned next to each other at the optical axis of the lens 122. Eachof the optical fibers 124, 126 depicted in FIG. 8 may actually be asmall bundle of optical fibers. The optical fiber 124 has its other end124 b coupled to a light source 128. The light source emits light of awavelength at which the mask 18 is transparent, typically visiblewavelengths for a quartz mask. In the case of interference depthmeasurements, the wavelength spectrum of the light source 128 isselected to facilitate local coherence in the reticle pattern of themask 18. For periodic features in the etched mask structure on the orderof about 45 nm (or periodic feature sizes below one micron), thisrequirement is met if the light source 128 radiates in the visible lightspectrum. The optical fiber 126 has its other end 126 b coupled to alight receiver 130. In the case of simple end point detection, the lightreceiver 130 may simply detect light intensity. In the case of criticaldimension (e.g., line width) measurements, the light receiver 130 maysense the image of etched lines within the field of view of the lens122, from which the line width can be determined. In the case of etchdepth measurements, the light receiver 130 may detect an interferencepattern or interference fringes, from which the etch depth may bedetermined (i.e., inferred from the interference or diffraction patternor computed from the counting of interference fringes). In otherembodiments, the light receiver 130 may include a spectrometer forperforming multiple wavelength interference measurements, from whichetch depth may be inferred or computed. For such determinations, theprocess controller 60 includes an optical signal processor 132 capableof processing the optical signal from the light receiver. Such opticalsignal processing may involve (depending upon the particularimplementation) one of the following: performing etch process end pointdetection from ambient light intensity changes; measuring criticaldimensions from two-dimensional images sensed by the optical receiver130; computing etch depth by counting interference fringes; determiningetch depth from the multiple wavelength interference spectrum, in whichcase the optical receiver 130 consists of a spectrometer. Alternatively,such a spectrometer may be employed to perform etch process end pointdetection by optical emission spectrometry from the wafer backside,using light emitted by the plasma and transmitted through thetransparent mask 18, in which case the light source 128 is not employed.

The process controller 60 reacts to the process end point detectioninformation (or the etch depth measurement information) from the opticalsignal processor 132 to control various elements of the plasma reactor,including the RF generators 24, 26, 48 and the wafer-handling apparatus61. Typically, the process controller 60 stops the etch process andcauses removal the mask 18 from the pedestal 16 when the etch processend point is reached.

FIG. 9 is a graph depicting ambient reflected light intensity sensedfrom the top (photoresist-coated) side of the mask as a function of timeduring a chrome etch process (in which a chrome thin film on the quartzmask surface is etched in accordance with a mask reticle pattern). Thelarge swings in intensity depicted in the graph of FIG. 9 representnoise induced by roughness in the top surface of the photoresist layer.The dashed line represents a step function signal hidden within thenoise, the step function coinciding with the chrome etch process endpoint. FIG. 10 is a graph of the same measurement taken from the waferbackside through the cathode 44 in the reactor of FIG. 8, in which thelight receiver 130 senses the reflected light level. Thephotoresist-induced noise is greatly reduced, so that the end-pointdefining step function is clearly represented in the optical data. Theedge of the step function depicts a transition point at which reflectedlight intensity drops upon the etch process reaching the bottom of thechrome thin film, at which point the reflective surface area of thechrome is abruptly reduced.

FIGS. 11 and 12 are graphs of light intensity over time (or,equivalently, over space), and, in FIG. 12, as sensed by the opticalreceiver 130, in which the periodic peaks in light intensity correspondto interference fringes whose spacing determines the etch depth, ordifference in thickness between different surfaces of closelyperiodically spaced features etched in the transparent quartz masksubstrate 18. FIG. 11 depicts the intensity sensed through thephotoresist from the top side of the mask, with a heavyphotoresist-induced noise component that impairs interference fringedetection. FIG. 12 depicts the intensity sensed through the maskbackside by the optical receiver 130 of FIG. 8, in whichphotoresist-induced noise is virtually absent.

FIG. 13 is a graph representing light intensity as a function ofwavelength for the case in which the light receiver 130 consists of aspectrometer and the light source 128 produces a spectrum ofwavelengths. The behavior of the intensity spectrum of the graph of FIG.13 is typical of a situation in which interference effects occur betweenlight reflected from surfaces of different depths in sub-micron featuresthat are periodically spaced in the transparent mask 18. At the lowerwavelengths, the peaks are fairly periodic and even spaced, thepredominant optical effect being interference. At the higherwavelengths, local coherence among the periodic features in the mask 18is not as strong, so that diffraction effects become increasinglysignificant with increasing wavelength, causing the intensity behaviorat the higher wavelengths to be less evenly spaced and more complex, asdepicted in FIG. 13. The spacing of the peaks in FIG. 13, particularlyat the lower wavelengths, is a function of the etch depth, which may beinferred from the peak-to-peak spacing.

FIG. 14 illustrates an embodiment of the reactor of FIG. 8, in which thelight receiver 130 is an ambient light intensity detector and theoptical signal processor 132 is programmed to look for a largeinflection (step function) in the overall reflected light intensity,corresponding to the end point detection graph of FIG. 10. The lightsource 128 in this embodiment can be any suitable light source.Alternatively, the light source 128 can be eliminated, so that the lightsensor 130 simply responds to light from the plasma transmitted throughthe transparent mask or substrate 18.

FIG. 15 illustrates an embodiment of the reactor of FIG. 8 in which thelight receiver 130 is an interference fringe detector sufficientlyfocused by the lens 122 to resolve interference fringes, and the opticalsignal processor 132 is programmed to count interference fringes (e.g.,from intensity versus time data of the type illustrated in FIG. 12) inorder to compute etch depth in the transparent quartz mask 18. Thiscomputation yields a virtually instantaneous etch depth, which iscompared by logic 200 with a user-defined target depth stored in amemory 202. The logic 200 can use a conventional numerical match orminimization routine to detect a match between the stored and measureddepth values. A match causes the logic 200 to flag the etch end point tothe process controller 60.

FIG. 16 illustrates an embodiment of the reactor of FIG. 8 which employsthe interference spectroscopy technique of FIG. 13 to measure ordetermine etch depth in the transparent quartz mask or substrate 18. Inthis case, the light source 128 emits multiple wavelengths or a spectrumin the visible range (for periodic mask feature sizes on the order ofhundreds of nanometers or less). The light receiver 130 is aspectrometer. A combination signal conditioner and analog-to-digitalconverter 220 converts the spectrum information collected by thespectrometer 130 (corresponding to the graph of FIG. 13) into digitaldata which the optical signal processor 132 can handle. One mode inwhich end point detection can be performed is to compute the etch depthfrom the spacing between the periodic peaks in the lower wavelengthrange of the data represented by FIG. 13, as mentioned above. Comparisonlogic 200 can compare the instantaneous measured etch depth to auser-defined target depth stored in memory 202 to determine whether theetch process end point has been reached. In another mode, the comparisonlogic 200 is sufficiently robust to compare the digitally representedwavelength spectrum (corresponding to the graph of FIG. 13) representingthe instantaneous output of the spectrometer 130 with a known spectrumcorresponding with the desired etch depth. This known spectrum may bestored in the memory 202. A match between the measured spectrum and thestored spectrum, or an approximate match, detected by the comparisonlogic 200 results in an etch process end point flag being sent to theprocess controller 60.

FIG. 17 illustrates an embodiment of the reactor of FIG. 8 in which theoptical receiver 130 is an optical emission spectrometer capable ofdifferentiating emission lines from optical radiation emitted by theplasma in the chamber, to perform optical emission spectrometry (OES).The processor 132 is an OES processor that is programmed to track thestrength (or detect the disappearance) of selected optical linescorresponding to chemical species indicative of the material in thelayer being etched. Upon the predetermined transition (e.g., thedisappearance of a chrome wavelength line in the OES spectrum during achrome etch process), the processor 132 sends an etch process end pointdetection flag to the process controller 60.

FIG. 18 depicts an embodiment that we have constructed, having a pair oflenses 230, 232 in respective spaced recesses 231, 233 in the surface ofthe cathode 44, the lenses 230, 232 being focused to resolveinterference fringes, the focused light being carried by respectiveoptical fibers 234, 236 facing or contacting the respective lenses 230,232. The optical fibers 234, 236 are coupled to an interference detector238 (which may be either a fringe detector or a spectrometer), thedetector 238 having an output coupled to the process controller 60. Thelenses 230, 232 receive light from a light source 240 through opticalfibers 242, 244. This light is reflected from the top surface of themask 18 back to the lenses 230, 232 and carried by the optical fibers234, 236 to the detector 238. In addition, the embodiment of FIG. 18 hasa third recess 249 in the cathode surface accommodating a third lens 250coupled through an optical fiber 252 to the input of an OES spectrometer254. An OES processor 256 processes the output of the OES spectrometer254 to perform end point detection, and transmits the results to theprocess controller 60. The cathode 44 of the embodiment of FIG. 18 isdepicted in FIG. 19, showing the three recesses 231, 233, 249accommodating the respective lenses 230, 232, 250. FIG. 20 illustratesthe corresponding holes 260, 261, 262 for accommodating within thefacilities plate 46 optical apparatus (not shown) supporting the lenses230, 232, 250. FIG. 21 is a cross-sectional view showing the coupling ofthe optical fibers to the lenses inside the pedestal 16.

While the reactors of FIGS. 16, 17 and 18 have been described asemploying spectrometers 130 (FIGS. 16 and 17) and 254 (FIG. 18), thespectrometer 130 or 254 may be replaced by one or more opticalwavelength filters tuned to predetermined wavelengths. Each such opticalwavelength filter may be combined with a photomultiplier to enhance thesignal amplitude.

Backside End Point-Detected Mask Etch Processes:

FIGS. 22A and 22B depict a process for etching a reticle pattern in thequartz material of a mask. In FIG. 22A, a quartz mask substrate 210 hasbeen covered with a photoresist layer 212 having a periodic structure ofspaced lines 214 and openings 216 defined in the photoresist layer 212.In the reactor of FIG. 15 or 16, a quartz-etching process gas ofCHF3+CF4+Ar is introduced into the chamber 10, power is applied by theRF generators 24, 26 and 48 and the quartz material is etched within theopenings 216 formed in the photoresist layer 212. The etch depth in thequartz is continually measured by interference between light 218reflected from an etched top surface and light 219 reflected from anunetched top surfaces of the quartz substrate 210. The etch process ishalted as soon as the desired etch depth is reached (FIG. 22A). Thephotoresist is then removed to produce the desired mask (FIG. 22B).

FIGS. 23A through 23E depict a process for etching a three-layer maskstructure consisting of the underlying quartz mask substrate 210, amolybdenum silicide layer 260, (containing molybdenum oxy-siliconnitride), a chrome layer 262, a chromium oxide anti-reflective coating264 and a photoresist layer 266, with openings 268 formed in thephotoresist layer 266 (FIG. 23A). In the step of FIG. 23B, the chromelayer 262 and the anti-reflection coating 264 are etched in a plasmareactor chamber having simple reflectance end point detection (thechamber of FIG. 14) or having OES end point detection (the chamber ofFIG. 17) using a chrome etch process gas such as C12+O2+CF4. Thephotoresist layer 266 is removed (FIG. 23C). The molybdenum silicidelayer 260 is then etched as shown in FIG. 23D, using a process gas whichis an etchant of molybdenum silicide, such as SF6+C12, and using thechrome layer 262 as a hard mask. This step is carried out in a plasmareactor having end point detection by simple ambient reflectance or byOES end point detection, such as the chamber of FIG. 14 or FIG. 17. InFIG. 23E, the chrome layer 262 and the chromium oxide anti-reflectioncoating 264 are removed using a chrome etching process gas such asCH3+CF4+Ar. This step can be carried out using the reactor of FIG. 14 or17 having simple end point detection without etch depth measurement.This leaves a quartz mask substrate with an overlying layer ofmolybdenum silicide defining the reticle pattern.

FIGS. 24A through 24E depict a process for fabricating a binary maskconsisting of periodic chrome lines on a transparent quartz maskflanking periodic spaces of exposed quartz, alternate ones of theexposed quartz spaces being etched to a depth at which transmitted lightis phase-shifted by a desired angle (e.g., 180 degrees). FIG. 24Adepicts the initial structure consisting of a quartz mask substrate 300,a chrome layer 302, a chromium oxide anti-reflection coating 304 and aphotoresist layer 306. In the step of FIG. 24B, the chrome and chromiumoxide layers 302, 304 are etched in a process gas of C12+O2+CF4 in areactor chamber such as the chamber of FIG. 14 or 17. In the step ofFIG. 24C, the photoresist layer 306 is removed, after which the exposedportions of the quartz mask substrate 300 are etched as shown in FIG.24D in a quartz-etching process gas of CHF3+CF4+Ar. The quartz etch stepof FIG. 24D is carried out in a reactor chamber capable of sensing ormonitoring the etch depth in the quartz mask substrate 300, such as thechamber of FIG. 15 or 16. During the etch process, the instantaneousetch depth is continually monitored, and the etch process is halted assoon as the target etch depth is reached on the mask 300. The finalresult is depicted in FIG. 24E.

Continuous Monitoring of Etch Rate Distribution Across the Mask Surface:

FIGS. 25 and 26 illustrate an embodiment of the wafer support pedestal16 of FIG. 1 with a matrix of backside etch depth sensing elements(lenses and optical fibers) in the top surface of the cathode 44,continuously providing an instantaneous image or sample of the etch ratedistribution or etch depth distribution across the entire surface of themask or substrate during the etch process without interrupting the etchprocess or otherwise disturbing the mask substrate. The aluminum plateau44 a has a matrix of openings 320 in its top surface, each openingholding a lens 322 facing the backside of the mask substrate 300. Alight source 324 provides light through output optical fibers 326coupled to the respective lenses 322. The lenses 322 provide sufficientfocusing to resolve interference fringes. An interference detector 328,which may be either a sensor that facilitates fringe counting or aspectrometer, is coupled to input optical fibers 330 coupled to therespective lenses 322. A switch or multiplexer 332 admits light to thedetector 328 from each of the input optical fibers 330 sequentially.There are three modes in which the apparatus of FIGS. 25 and 26 mayoperate. In a first mode, the etch depth in the field of view of a givenone of the lenses 322 is computed from the interval between interferencefringes. In a second mode, the detector 328 is a spectrometer and theetch depth in the field of view of a given one of the lenses 322 iscomputed from the lower wavelength peak interval of the multiplewavelength interference spectrum (corresponding to FIG. 13). In a thirdmode, the multiple wavelength interference spectrum is detected at agiven instant of time and compared with a library 340 of spectra forwhich the corresponding etch depths are known. The etch ratedistribution is computed from the etch depth and the elapsed time. Thisdistribution records the etch nonuniformity of the process and is fed tothe process controller 132. The controller 132 can respond by adjustingtunable features of the reactor to reduce non-uniformity in the etchrate distribution.

While the embodiment of FIGS. 25 and 26 is depicted as having a 3-by-3matrix of etch depth sensors or lenses 322 in the top surface of theplateau 44 a, any number of rows and columns in the matrix of suchsensors may be employed so that the matrix is an n-by-m matrix, where mand n are suitable integers.

In one embodiment, the process controller 132 may be programmed todeduce (from the etch rate distribution information supplied by thespectrometer or sensor 130) whether the etch rate distribution is centerhigh or center low. The process controller 60 can respond to thisinformation by adjusting certain tunable features of the reactor todecrease the non-uniformity. For example, the process controller 60 maychange the RF power apportionment between the inner and outer coils 20,22. Alternatively or in addition, the process controller 60 may changethe height of the movable aluminum plate 112 in the reactor of FIGS. 6and 7. Feedback from the array or matrix of etch depth sensing elementsin the plateau 44 a allows the process controller 60 to improveuniformity of etch rate distribution by continuous trial and erroradjustments of the reactor tunable elements.

While the foregoing is directed to embodiments of the present invention,other and further embodiments of the invention may be devised withoutdeparting from the basic scope thereof, and the scope thereof isdetermined by the claims that follow.

1. A plasma reactor for processing a workpiece, comprising: a vacuumchamber having a ceiling and a sidewall; a workpiece support pedestalwithin said chamber including a cathode having a surface for supportinga workpiece, said surface comprising plural respective zones, saidrespective zones of said surface being formed of respective materials ofdifferent electrical characteristics.
 2. The apparatus of claim 1wherein said zones are arranged concentrically relative to an axis ofsymmetry of said wafer support pedestal.
 3. The apparatus of claim 2wherein said zones comprise an inner zone and an annular outer zone, thematerial of said inner zone comprising a conductor and the material ofsaid outer zone comprising an insulator.
 4. The apparatus of claim 2wherein said respective materials comprise insulator materials ofdifferent electrical permittivities.
 5. The apparatus of claim 1 whereinsaid cathode comprises an aluminum piece having a top surface and saidplural respective zones of said surface comprise respective inserts ofthe respective materials.
 6. The apparatus of claim 5 wherein saidrespective inserts are concentric.
 7. The apparatus of claim 5 whereinsaid respective inserts comprise a first insert formed of a conductivematerial and a second insert formed of a non-conductive material.
 8. Theapparatus of claim 5 wherein said respective inserts comprise respectivematerials of different electrical permittivities.
 9. The apparatus ofclaim 7 wherein said first insert comprises a disk-shaped center insertand said second insert comprises an annular outer insert.
 10. Theapparatus of claim 1 wherein said cathode is formed of a first metal,said apparatus further comprising: a facilities plate formed of saidfirst metal, said cathode having a bottom surface and said facilitiesplate having a top surface facing the bottom surface of said cathode;plural elongate fasteners formed of a second metal having a higherstrength and different electrical property than said first metal, saidplural elongate fasteners joining said cathode and said facilities platetogether along a periphery of said cathode and facilities plate; and athin ring layer between said cathode and said facilities plate formed ofsaid second metal and being located at the periphery of said cathode andfacilities plate.
 11. The apparatus of claim 10 further comprising: acoating of a third metal on the periphery of said bottom surface of saidcathode and a coating of said third metal on the periphery of said topsurface of said facilities plate, said third metal having an electricalconductivity higher than the electrical conductivity of said firstmetal.
 12. The apparatus of claim 10 further comprising: an annulargroove in one of (a) said top surface of said facilities plate, (b) saidbottom surface of said cathode, said annular groove being located at theperiphery thereof, and a conductive compressible gasket within saidannular groove.
 13. The apparatus of claim 10 wherein said first metalcomprises aluminum and said second metal comprises titanium.
 14. Theapparatus of claim 10 wherein said fasteners are threaded fasteners. 15.The apparatus of claim 11 wherein said third metal comprises nickel. 16.The apparatus of claim 1 wherein said cathode in the form of a diskhaving a rectangular plateau, said top surface for supporting aworkpiece being the top surface of said plateau, said disk and plateaubeing formed of said first metal, said plateau conforming generally tothe shape of a mask.
 17. The apparatus of claim 16 further comprising: aring surrounding said plateau and having a top ring surface that canform a contiguous flat surface with a workpiece that can be supported onsaid plateau, said ring comprising plural layers of different insulatormaterials.
 18. The apparatus of claim 17 wherein said plural layers insaid ring are selected to provide an electrical impedance that matchesan electrical impedance through said plateau in the presence of saidworkpiece.
 19. A wafer support pedestal for use in a plasma reactor,comprising: a cathode formed of a first metal; a facilities plate formedof said first metal, said cathode having a bottom surface and saidfacilities plate having a top surface facing the bottom surface of saidcathode; plural elongate fasteners formed of a second metal having ahigher strength that said first metal, said plural elongate fastenersjoining said cathode and said facilities plate together along aperiphery of said cathode and facilities plate; a thin ring layerbetween said cathode and said facilities plate formed of said secondmetal and being located at the periphery of said cathode and facilitiesplate; a coating of a very high conductivity metal on the periphery ofsaid bottom surface of said cathode and a coating of said very highconductivity metal on the periphery of said top surface of saidfacilities plate; and an annular groove in one of (a) said top surfaceof said facilities plate, (b) said bottom surface of said cathode, saidannular groove being located at the periphery thereof, and a conductivecompressible gasket within said annular groove.
 20. The wafer supportpedestal of claim 19 further comprising respective concentric inserts ofrespective electrical characteristics on a top surface of said cathode.